Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics

Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk of component failure due to overheating, according to a new study published in the journal of Advanced Materials led by researchers at the University of Illinois at Chicago College of Engineering.

Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics

Sandwiching two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases and an ultrathin layer of aluminum oxide can significantly reduce the risk ...

Wed 12 Sep 18 from Phys.org

Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics, Thu 13 Sep 18 from ScienceDaily

Nano-sandwiching improves heat transfer, prevents overheating in nanoelectronics, Wed 12 Sep 18 from Eurekalert

Nano-Sandwiching Enhances Heat Transfer in Nanoelectronics

Sandwiching two-dimensional (2D) materials used in nanoelectronic devices between their three-dimensional (3D) silicon bases and an ultrathin layer of aluminum oxide can greatly lower the risk ...

Fri 14 Sep 18 from AZoNano

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